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May 2007

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Subject:
From:
Gary Bremer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gary Bremer <[log in to unmask]>
Date:
Tue, 29 May 2007 20:29:00 -0700
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Where is it stated that the conductive pattern can not have any exposed 
copper on the vertical surfaces?  Is that any empirical data that supports a 
failure mode if there is exposed copper on the vertical surfaces of a 
conductive pattern? I have searched MIL-STD-2000, NASA-STD-8739-2 and 
NASA-STD-8739-3 but can only find that it is allowed. Where I work those 
with PhD's worry about exposed copper on the vertical edges of the 
conductive patterns and are scared to allow to move forward because of 
possible failure modes with a deep space launch. For my limited knowledge of 
metallurgy: after copper is exposed to moisture and oxygen, corrosion takes 
place only on the surface and does not migrate any further. I do have access 
to NHB5300 to see if exposed copper was not allowed.


Gary Bremer

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