TECHNET Archives

May 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Tue, 29 May 2007 09:52:41 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (58 lines)
I'd be real appreciative of getting details on this topic also. Seems
that everyone agrees that mositure is detrimental for a PCB on multiple
levels but good documented evidence, & studies seem to be short supply. 

BTW- One recent study on this subject was however presented at APEX this
past year by Paul Hamilton of Intel. 

Rich K / GTS
847-621-7310
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Tuesday, May 29, 2007 8:16 AM
To: [log in to unmask]
Subject: [TN] PWB Moisture Diffusion Rates

Fellow Technetters,

Anyone have data on moisture diffusion in and out of various PWB
materials? For various thicknesses, geometry, layers?

Is anyone treating boards differently through any processes, such as
duration and temperature of pre-build bake, or maximum time allowed out
of packaging before baking (for initial build or hand soldering /
rework) based on material or physical dimensions?

Ben Gumpert



---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2