There are different requirements for hole fill and solder wetting
circumferance for different classes. The requirements are outlined in
both J-STD-001D and IPC-A-610D. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Alexander
Sent: Tuesday, May 29, 2007 8:19 AM
To: [log in to unmask]
Subject: [TN] Fw: Status of IPC Solder Inspection Criteria

I apologize for the email chain but I wanted to get your opinions on
criteria for supported hole solder fill and pad wetting.  At the end of
the day I will provide the customer with what they want but I wanted to
get your opinions on the IPC-A-610 interpretations. 





---

Joe,

IPC do differentiate between wetting and solder fill.

   75% solder fill in the hole is acceptable
   180 degree top side wetting from lead to barrel is considered
   acceptable.
To clarify, the 75% fill is true as long as long you have wetting to the
top side lead to barrel transition and "0" wetting to the copper pad.

 
 
 
 
 
 





Eli,

It  states lead to barrel not lead to land. If the fill requirement is
only 75%, then the land on the top side will not be wetted unless you
have 100% fill.


Joel Alexander
Quality Assurance Manager
 
 
 
 
 
 
 
 





Joe,

What about section B




Lead to pad transition on the primary side.















Eli,

I attached an extract from IPC-A-610 Rev D.  Wetting between the lead to
land is a Target condition and should not be cause for rejection.

Let me know if you want to discuss this further and Bill can set up a
conference call.


















Elie, I forwarded your email to our Quality Manager.















Bill,

There is  a misunderstanding of the way you interpret the acceptance
criteria of the lead-free solder connection vs. ours.  To my
knowledge, there should be  a wetting between the lead to pad transition

on
the component side of the board.  Your manufactured boards do not meet
this criteria.  Please let me know how we can resolve this issue?




ForwardSourceID:NT000B7562 

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