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Subject:	PWB Moisture Diffusion Rates
From:	"Gumpert, Ben" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:	Tue, 29 May 2007 08:16:15 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (24 lines)

Fellow Technetters,

Anyone have data on moisture diffusion in and out of various PWB
materials? For various thicknesses, geometry, layers?

Is anyone treating boards differently through any processes, such as
duration and temperature of pre-build bake, or maximum time allowed out
of packaging before baking (for initial build or hand soldering /
rework) based on material or physical dimensions?

Ben Gumpert



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