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May 2007

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Subject:
From:
"Braddock, Iain" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Braddock, Iain
Date:
Mon, 28 May 2007 10:08:08 +0100
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Following the initial findings the other week I managed to get a 2nd
failed board assessed in the lab; the result was identical to the 1st
findings.
 
The multi-layer flexi part of the board is made up with some air gaps
between ie. not bonded together to facilitate bending. It would appear
some contamination got into the air gap and attacked the Polyimide
changing its properties such that it became conductive, hence the short
circuit across nets.
 
The board has been sent to our specialist lab. for further analysis;
I'll let you know the outcome.


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