TECHNET Archives

May 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
David Tremmel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Tremmel <[log in to unmask]>
Date:
Sat, 26 May 2007 19:41:50 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (89 lines)
Hello,

Regarding laptops:

The problem may not only be the LF reliability issue.  More and more the
BGAs are being lined with chipbonder to prevent solder-creep fatigue due to
the 'cheap' construction of the case assembly.

Pick up an IBM Thinkpad; chances are you will not see too much stress being
placed on the motherboard because the case assembly is absorbing the stress.
Pick up an HP, Compaq, etc. and see how much mechanical stress is being
placed on the motherboard.  Solder-creep fatigue on BGAs, SOICs and QFPs is
what I see constantly.

Surface mount capacitors on the motherboard cracking right where the most
force is applied when you pick up the laptop.  They crack right where the
capacitor makes physical contact with the motherboard and you do not see it
because the crack is covered by the solder joint.

If you purchase a laptop and keep it on your desk then you can probably get
away with a 'less expensive' model.  If you use your laptop between work and
home or travel, get yourself a business laptop; one which the case assembly
absorbs the stress of handing and not the logic board itself.

Next time you are at Best Buy, Circuit City, etc. go pick up a laptop and
see what I mean.

Have a nice holiday, Technetters.

Thank you,
 
David Tremmel

 
-----Mensaje original-----
De: TechNet [mailto:[log in to unmask]] En nombre de Werner Engelmaier
Enviado el: Saturday, May 26, 2007 7:16 PM
Para: [log in to unmask]
Asunto: Re: [TN] RoHS compliant laptop with early failure

Hi Joe,
Sorry to say their is an epidemic of of failing laptops.
The Danish government is going after Apple, there is a class action against 
Sony, I also heard about problems with HP and Dell...and to my knowledge, it
is 
all SJ failures.
I do not know whether it is LF or laptops getting smaller and with more 
functionality and running hot-most likley some combination. I have ssen
pictures of 
people using C-clamps on laptop housings to be able to start their laptops-
putting pressure on the SJ fracture surfaces to make electrical contact.
It seems, DfR has never been heard of by this people.
However, your laptop takes the cake for customer...on the other hand, I have

heard of DOA's right out of the box at distribution centers.



Werner



**************************************
 See what's free at http://www.aol.com.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2