I've asked the same thing on a board-layout listserver and I got no reply.

It would be interesting to see if anyone is using this method.

http://www.uyemura.com/library-3.htm

Regards,

Bob Wilson
E/M Designer, CID
SpectraSensors, Inc.
11027 Arrow Route
Rancho Cucamonga, CA 91730
(909) 948-4110
www.spectrasensors.com

 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Lefebvre
Sent: Monday, April 30, 2007 5:51 PM
To: [log in to unmask]
Subject: [TN] ENIG vs. IG over Copper DIG.

Currently I have been using ENIG as my primary lead free solder finish
but I've been reading about Direct Immersion Gold "DIG".  Direct
immersion gold is deposited directly on the copper surface to a
thickness of 1-2 uins.  I want to know if anyone in Technet has any
experience with this finish.

 

I use both water soluble solder and no clean solder flux in our current
process.  The lead free solder is SAC305 for both SMT and through-hole.

 

One of the drawbacks I could think of is copper dissolution when
soldering the boards with SAC305 solder.  I have not had any issues
using our existing ENIG solder finish but one of our new PCB shops have
asked if we could switch.

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