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May 2007

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 22 May 2007 13:35:41 -0500
Content-Type:
text/plain
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text/plain (66 lines)
And more boards will delaminate, or develop via Z-axis expansion
reliability issues. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Tuesday, May 22, 2007 1:27 PM
To: [log in to unmask]
Subject: Re: [TN] SN100C vs. SAC305

	And more components will be degraded because of the LF Hi Temps
used.
	Ramon 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, May 22, 2007 2:02 PM
To: [log in to unmask]
Subject: Re: [TN] SN100C vs. SAC305

Hi Ioan,
Sure there is a reason-SN100C has a higher Liquidus temperature; thus,
more profiles will run at too low a temperature.

Werner



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