Richard,
You should also read "Mixed Metallurgy: Reliability of SAC Balled Area
Array Packages Assembled Using SnPb Solder", Heather McCormick et al,
Celestica, given at SMTAI, Chicago, 2006.
And Dave Hillman has a paper that he gave at the International Lead Free
Conference in Toronto (I think last year), that talks about when the
solder/ball metals do not mix completely. Contact Dave for more
details.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Thursday, May 17, 2007 10:10 AM
To: [log in to unmask]
Subject: Re: [TN] Changing BGA solderballs from SAC405 to SAC105
Thank you, Ioan!
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Thursday, May 17, 2007 8:48 AM
To: [log in to unmask]
Subject: Re: [TN] Changing BGA solderballs from SAC405 to SAC105
Hi Richard,
as communicated directly to you, one of the papers was written by G.
Wenger (Mixed Alloy Solder Joint Reliability 'Sanity Check').
Unfortunately I did not save the link, but maybe he can help.
Regards,
Ioan
-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]]
Sent: Thursday, May 17, 2007 9:28 AM
To: TechNet E-Mail Forum; Tempea, Ioan
Subject: RE: [TN] Changing BGA solderballs from SAC405 to SAC105
Ioan,
Where are these studies showing that soldering of LF BGAs with leaded
solder is a good practice? Can you post a link?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Thursday, May 17, 2007 6:58 AM
To: [log in to unmask]
Subject: Re: [TN] Changing BGA solderballs from SAC405 to SAC105
Well Phil,
I haven't really been following this, but I am worried. We already have
too many customers asking us to solder LF BGAs with leaded solder and
the deal was to get the BGA balls to melt, at around 220C. I was happy
that studies started to surface showing this was good practice and the
result was reliable.
How will I be able to solder the SAC105 with leaded? And we already have
an inspector full time on the XRF, just to make sure Pb is not there.
Now I will have to ask them to measure the composition of the balls...
When will it end?
Just my concerns!
Ioan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phillip Bavaro
Sent: Wednesday, May 16, 2007 8:31 PM
To: [log in to unmask]
Subject: [TN] Changing BGA solderballs from SAC405 to SAC105
I haven't been following the transition to use SAC105 so I would
appreciate any advice those of you who have already gone down this path
might have.
SAC405 and SAC305 was considered compatible with our SAC305 paste, but
now there is a component which is changing the solderballs to SAC105.
SAC105 has a higher liquidus temperature (226 C) than SAC305 (217 C) .
Is this going to impact our assembly processes?
Does it only tighten up the reflow process window?
Is this transition something that the majority of manufacturers of
components are going to undertake soon?
Thanks in advance,
Phil
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