TECHNET Archives

May 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Black, Paul" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Black, Paul
Date:
Thu, 17 May 2007 10:27:41 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines)
Hi Everyone,

A little while ago, I asked for advise regarding a tombstoning issue with a MELF. I received some replies and they all indicated that the pads are probably too large. Now, I would like to run an experiment to prove that out before changing the artwork on the board. I asked my board fabricator if they could rework some boards by adding soldermask to half the pad but I was told that the mask wouldn't adhere over the Immersion Silver finish on the pad. Does anyone have a suggestion that I could try?

Thank you,
Paul Black
Manufacturing Engineer
Kronos Incorporated

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2