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May 2007

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Subject:
From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tempea, Ioan
Date:
Thu, 17 May 2007 07:57:39 -0400
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Well Phil,

I haven't really been following this, but I am worried. We already have too many customers asking us to solder LF BGAs with leaded solder and the deal was to get the BGA balls to melt, at around 220C. I was happy that studies started to surface showing this was good practice and the result was reliable.

How will I be able to solder the SAC105 with leaded? And we already have an inspector full time on the XRF, just to make sure Pb is not there. Now I will have to ask them to measure the composition of the balls... When will it end?

Just my concerns!

Ioan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phillip Bavaro
Sent: Wednesday, May 16, 2007 8:31 PM
To: [log in to unmask]
Subject: [TN] Changing BGA solderballs from SAC405 to SAC105


I haven't been following the transition to use SAC105 so I would appreciate 
any advice those of you who have already gone down this path might have.

SAC405 and SAC305 was considered compatible with our SAC305 paste, but now 
there is a component which is changing the solderballs to SAC105.

SAC105 has a higher liquidus temperature (226 C) than SAC305 (217 C) .

Is this going to impact our assembly processes?

Does it only tighten up the reflow process window?

Is this transition something that the majority of manufacturers of 
components are going to undertake soon?

Thanks in advance,

Phil

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