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May 2007

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Subject:
From:
Jihua Du <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jihua Du <[log in to unmask]>
Date:
Thu, 10 May 2007 09:31:24 -0700
Content-Type:
text/plain
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text/plain (23 lines)
Dera ll,

I am trying to design a part where a gold plated
copper termail is soldered to a polyimide PCB. Since
the thermial will be subject to mechanical pulling and
peeling during operation, The strength of the bonding
is critical. Could you suggest any good solder? Is
SnAg good enough? Preform is better or solder paste?

Thanks

Jim

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