I do not understand why anyone would ever want to dispense paste from a jar when it is available in Nelco cartridges? The cartridges are sealed except for the small nozzle which can be recapped. Every time you open the jars you expose a large amount to air (read: humidity). Invariably, with the jars, the operators can leave them open and expose the paste to the air. Hard to do when the paste is in a cartridge.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Miguel Vallejo
Sent: Monday, May 07, 2007 4:04 PM
To: [log in to unmask]
Subject: Re: [TN] SN100C vs. SAC305
Hi Yannick,
You need to make sure you're not introducing moisture in the solder, by opening the jar while the solder is cold; allow it to come to room temperature before opening the jar. This can take 4-6 hrs, so a suggestion is to bring it out at the end of the day for next day use, or one shift brings out at the beginning of the shift for next shift's use.
Furthermore, the process window is much smaller, so the ramp-up deg/sec, soak time at about 150 degC, spike rate and pick temp variations are less forgiving.
I would recommend a ramp-up (to 150 deg C)of 2-3 degC/sec and soak at about 150-160 deg C, for about 1.5 mins. then spike to reflow in about 30 secs.
Stay at liquidous for about 45 secs. One visual check is to make sure the flux residue looks wet, not burnt.
Let me know if this helps, good luck.
Miguel
-----Original Message-----
From: Yannick Brisson [mailto:[log in to unmask]]
Sent: Monday, May 07, 2007 4:50 AM
To: [log in to unmask]; [log in to unmask]
Subject: RE: [TN] SN100C vs. SAC305
Hi,
You wrote that you use FCT SN100C since 1 year, we usually use it in our product but since 1 month we found some blow hole and void in our SMD solder joint, we use immersion tin plating. We spoke with their guru's but we are unable to find any reason for that. Those blow hole and voids are most of the times on LED with gold plating, do you have some ideas for us to solve our problem??
Thank You
Yannick
-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]]De la part de Miguel Vallejo Envoyé : 30 avril, 2007 18:21 À : [log in to unmask] Objet : Re: [TN] SN100C vs. SAC305
I've been using FCT SN100C for both SMT and TH. I started using this alloy since May 06. I've run around 30K boards, since, with no problems. Once dialed-in, the process is very stable, and results very predictable. What I love the most about this alloy is that the appearance is very similar to the leaded solder, so there is no need for second criteria for acceptability.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Monday, April 30, 2007 11:42 AM
To: [log in to unmask]
Subject: [TN] SN100C vs. SAC305
Dear Technos,
I need to know how is this combat evolving. This topic has been brought up several times, but things change fast right now and there must be more empirical data on the matter.
What I know regarding the 2 materials can be summarized:
* Pro SN100C: cheaper, better looking, eats less copper in the TH
* One major unknown - the Reliability: SN100C is not available in
solder paste format, therefore the boards would have SAC SMT joints and SN100C TH joints. This means 2 different materials and since we don't know how reliable a board with only one material is, should we risk introducing an extra variable?
I would like to know what your take is. Does anybody mixes the 2 materials?
Any reliability testing done? How long have you been doing it and do you see RMAs?
Thanks,
Ioan
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