Subject: | |
From: | |
Reply To: | |
Date: | Wed, 30 May 2007 07:44:36 +0100 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Brian,
I'm disappointed!
Vertical surface is always the up bit.
19th law of Trekkies - no matter who you are chasing/chasing you in space, you are always the same way up as your opponent. When did you ever see the USS Enterprise do a flip to meet another ship?
Colin W.T. McVean M.Inst.C.T
Production Manager
Artetch Circuits Ltd (www.artetch.co.uk)
Direct Dial 01903 712926
Switch Board 01903 725365
Skype: colin.artetch
40th Anniversary 1967 - 2007
P Before printing , please think about the Environment
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: 30 May 2007 07:37
To: [log in to unmask]
Subject: Re: [TN] Exposed copper (space applications)
How CAN you have a vertical surface in space?
Brian
Gary Bremer wrote:
> Where is it stated that the conductive pattern can not have any exposed
> copper on the vertical surfaces? Is that any empirical data that
> supports a failure mode if there is exposed copper on the vertical
> surfaces of a conductive pattern? I have searched MIL-STD-2000,
> NASA-STD-8739-2 and NASA-STD-8739-3 but can only find that it is
> allowed. Where I work those with PhD's worry about exposed copper on the
> vertical edges of the conductive patterns and are scared to allow to
> move forward because of possible failure modes with a deep space launch.
> For my limited knowledge of metallurgy: after copper is exposed to
> moisture and oxygen, corrosion takes place only on the surface and does
> not migrate any further. I do have access to NHB5300 to see if exposed
> copper was not allowed.
>
>
> Gary Bremer
>
> _________________________________________________________________
> PC Magazine�s 2007 editors� choice for best Web mail�award-winning
> Windows Live Hotmail.
> http://imagine-windowslive.com/hotmail/?locale=en-us&ocid=TXT_TAGHM_migration_HM_mini_pcmag_0507
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
> ext.2815
> -----------------------------------------------------
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|