Subject: | |
From: | |
Reply To: | |
Date: | Thu, 24 May 2007 16:18:38 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Werner
I am not sure where you are coming from. Steve referred to an immersion
silver finish on the board. Given that we have giga millions of immersion
silver solder joints and I have never seen or heard of a document case of
silver embrittlement resulting from these joints. Is it your opinion that
immersion silver can embrittle a solder joint?
Best regards
Lee
----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, May 24, 2007 2:38 PM
Subject: Re: [TN] Silver Embrittlement?
> Hi Steve,
> You sure got your problems.
> Yes, Ag-embrittlement is similar to, but actually worse than
> Au-embrittlement, and for the same reasons. Of course, combining them is
> giving you
> AghhhAuhhh-embrittlement [or is it Auhhh Aghhh?].
> TSOPs, unless made with a Cu-leadframe are bad news; there CTE's are c'ose
> to
> ceramic because of the alloy-42 CTE (a magnet can tell you). ...and TSOPs
> do
> not deserve to be called 'leaded components.'
> This compress a fractured SJ is used by a lot of people who's laptops are
> conking out because of SJ-failures.
>
> Werner
>
>
>
> **************************************
> See what's free at http://www.aol.com.
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|