各位好：
根据业界的需求，TGAsia在原有的 J-STD 任务组基础上，成立了第一个亚洲区的技术委员会----5-20CN技术委员会。现5-20CN正招募更多的志愿者（详见下面的倡议书（中英双语））。
如您是有关专家或技术人员，且有兴趣加入5-20CN，请您征得贵公司的同意后，在5月15日前回复确认信息，并请附上您的详细联系信息。
如您是公司的领导，且对5-20CN感兴趣，愿意派专家或技术人员加入，请在5月15日前回复确认信息，并请附上他们的详细联系信息。
谢谢您的鼎力支持与帮助！
Dear all,
According to the industry reqiurements, TGAsia has built the first technical committee, 5-20CN in Asia, based on initial J-STD Task Group
Now 5-20 are recruiting more volunteers (please see the folowing proposal in both English and Chinese).
If you are an expert or technician, and interested in joining the committee, please get the support of your company and reply the mail by May 15th with your detail contacting informations.
If you are a leader, and interested in the committee, would like to send out the appropriate expert(s) and/or technician(s) to join the committee, please reply the mail by May 15th with their detail contacting informations.
Thank you for your great support and help.
5-20CN组装与连接工艺委员会（亚洲区）倡仪书
IPC（美国电子工业联接协会）作为国际性的行业协会，一直引领着全球电子互连行业所有领域包括设计、印制电路板制造和电子组装的标准开发工作。到目前为止，出版了近200种已广泛应用于电子互连行业所有领域的标准。
随着制造行业逐步向亚洲转移，中国、马来西亚、新加坡及泰国等随处可见跨国公司的制造和研发中心。这些地区的专家技术人员不满足于仅仅停留在标准的应用和翻译，在IPC标准的优化、修订及制定中也将扮演越来越重要的角色。
5-20CN是IPC亚洲标准工作组TGAsia在亚洲区成立的第一个技术委员会，它的全称为“组装与连接工艺委员会（Assembly & Joining Processes Committee ）”。5-20技术委员会下设5个分委员会，每个分委员会又设若干任务组（详见附件1）。5-20CN成立于2006年，其秉承IPC 5-20技术委员会的宗旨与目标，关注有关组装与连接工艺系列标准的翻译、审核与修订。2006年至今已经完成部分标准的翻译工作。
J-STD-001至006系列标准的翻译、审核与修订是5-20CN委员会现阶段的主要任务之一，并将在适当的时候开展其他标准的开发工作。这一系列标准主要包括元器件/PCB的可焊性测试方法和质量标准、PCBA焊接要求、焊接材料标准等。该系列标准被EMS、OEM、PCB制造商、元器件制造商、组装材料和组装设备制造商广泛应用，是电子制造行业的基础性标准。随着无铅技术的逐步推广，这些基础性标准都需要进行优化升级。另外我们发现，在整个供应链中，存在着大量的有关可焊性测试方法和结果等的分歧和争论。这些问题部分是由于对标准的理解和执行不一致，部分是由于标准本身需要优化。
目前欲招募更多的同行志愿者，加入5-20CN。该委员会的目标是通过专家技术人员的共同研讨以及组织相应的应用研究，提升J-STD系列标准的行业应用水平，并为标准的修订和完善，贡献亚洲技术工作者的力量。专家的参与既可以提升个人技术能力，充分发挥专家在行业技术能力提升上的贡献，同时也可以扩大公司在行业的影响力。
志愿者加入5-20CN后，有义务及责任承担5-20CN委员会分配的具体工作。
5-20CN 计划于是2007年6月7日举办“5-20CN技术委员会第一次全体会议”，诚邀行业同仁踊跃加入5-20CN并参与此次研讨会。会议将介绍IPC技术委员会及工作组的活动模式，讨论委员会年度工作目标、计划及具体的任务分工、准则等。
IPC协会做为行业服务组织，将提供研讨的平台，并负责5-20CN委员会活动的组织与联络以及信息和成果的发布。
5-20CN技术委员会
2007年5月
附件1. 5-20技术委员会组成表
5-20技术委员会
每个任务组负责的标准
分委员会
任务组
5-21
5-21C
IPC-9501 评估电子元件用组装工艺仿真
5-21E
7526 模板与印错板清洗手册
5-21f
7095 BGA设计与组装工艺实施
5-21g
J029倒装芯片、芯片级封装及其它面阵列封装性能及可靠性测试方法
7094 倒装芯片及芯片级元件设计与组装工艺实施
5-22
5-22a
J-STD-001 焊接的电气电子组件的要求
5-22f
IPC-HDBK-001补充条款1及补充条款2 — J-STD-001增补手册及指南（B、C、D版对比）
5-22g
7913 印制电路板终端产品DPMO
5-22H
7530 批量焊接（再流焊及波峰焊）工艺温度曲线设定准则
5-23
5-23A
J-STD-003 印制板可焊性测试
5-23B
J-STD-002 元件引线、端接点、焊片、端子及导线可焊性测试
5-23D
TR-585 成板涂层可焊性的时间、温度及湿度应力
5-23E
JP002 JEDEC/IPC 目前锡晶须理论及减缓方法准则
5-24
5-24A
J-STD-004助焊剂的要求
5-24B
J-STD-005焊膏的要求
5-24C
J-STD-006 电子应用中电子级焊料合金及含助焊剂和不含助焊剂固体焊料的要求
5-25
5-25A
8413-1 用于装载制造中光纤的工艺载体技术规范
5-25D
IPC/JPCA-8425-1 采用玻纤的挠性光纤板详细技术规范
IPC/JPCA-8425-2 采用板波导的刚性光纤板详细技术规范
IPC/JPCA-8435-1 采用玻纤的SF型光纤板及连接器详细技术规范
IPC/JPCA-8435-2 采用玻纤的弯式光纤板连接器详细技术规范
Proposal Letter of 5-20CN Assembly & Joining Processes Committee in Asia
IPC（Association Connecting Electronics Industry）, as a international industry association, has been leading the standard development of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly in the world. By far, it has published nearly 200 standards which have been widely used in the electronics interconnect industry.
With manufacturing industry increasingly transferring to Asia, there are many manufacturing and R&D centers of multinational corporations everywhere in China, Malaysia, Singapore and Thailand. The experts and technicians in the areas haven’t only satisfied to apply and translate the standards. They will play a more and more important role in optimizing, revising, formulating the IPC standards.
5-20CN, its whole name is Assembly & Joining Processes Committee Asia, is the first technical committee which IPC TGAsia built in Asia in 2006. With the goal and mission of IPC 5-20 technical committee, 5-20CN focuses on translating, revising and formulating standards on assembly & joining processes. 5-20 is consisted of five subcommittees, every subcommittee concludes several task groups (see Appendix 1). By far, it has finished the translation of some standards.
Now one of the major tasks of 5-20CN is translating, reviewing and revising of J-STD-001 to 006 standards 5-20CN。At appropriate time, the developments of the other standards will be engaging on. These J-STD series standards are related to solderability test methods of components/PCB, the soldering requirements of PCBA, soldering materials standards, which have been widely applied by EMS, OEM, PCB manufacturers, component manufacturers, assembly material suppliers and assembly equipment suppliers. With spreading of lead-free technology, all of these basic standards are needed to optimize and upgrade. It is found there are a great amount of divergences and disputations existing in the whole supply chain. Some of these problems are the understanding and implementing on the standards aren’t consistent between them, the others are the standards are needed to optimize.
More volunteers are recruited to join in 5-20CN at the present. The goal of the technical 5-20CN technical committee is to improve the applying level of J-STD series standards in the related industry by discussing among experts and technicians and organizing concerned application research, and to contribute technical workers’ shares to revising and improving of the standards。The participating of experts and technicians may improve the individuals’ ability, make full of developing experts’ contributions to advancing the industry technology level, and can also promoting their company’s influence on the industry.
The volunteers have duties and responsibility to undertake the special tasks which are distributed by 5-20CN。
5-20CN are planing to held “The First Plenary Session of 5-20CN” in June 7. The industry colleagues are invited sincerely to join the committee and take part in the session. The session will introduce the activities modes of IPC committees and task groups, discuss annual goals, plans and the dividing of tasks and team rules, etc.
IPC will provide the service and the platform for researching, and are responsible for organizing and ensuring liaison 5-20CN activities, and distributing related information and outcomes.
5-20CN Technical Committee
May, 2007
Appendix 1 The Constitution of 5-20
5-20 Committee
Standard Names which are responsible by every task group
Subcommittee
Task Group
5-21
5-21C
IPC-9501 Assembly Process Simulation for Evaluation of Electronic Components
5-21E
7526 Stencil and Misprinted Board Cleaning Handbook
5-21f
7095 Design and Assembly Process Implementation for BGAs
5-21g
J029 Performance and Reliability Test Methods for Flip Chip, Chip Scale, BGA and Other Surface Mount Array Package Applications
7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
5-22
5-22a
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
5-22f
IPC-HDBK-001 with Amendments 1 and 2 - Handbook and Guide to Supplement J-STD-001 (Includes J-STD-001 B-C-D Comparisons)
5-22g
7913 End-Item DPMO for Printed Circuit Boards
5-22H
7530 - Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
5-23
5-23A
J-STD-003 Solderability Tests for Printed Boards
5-23B
J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
5-23D
TR-585 Time, Temperature and Humidity Stress of Final Board Finish Solderability
5-23E
JP002 JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
5-24
5-24A
J-STD-004 Requirements for Solder Fluxes
5-24B
J-STD-005 Requirements for Soldering Pastes
5-24C
J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
5-25
5-25A
8413-1 Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing
5-25D
IPC/JPCA-8425-1 Detail Specification for Flexible Optical Board using Glass Fiber
IPC/JPCA-8425-2 Detail Specification for Rigid Optical Board using Slab Waveguide
IPC/JPCA-8435-1 Detail Specification for Optical Board Connector Type SF Using Glass Fibers
IPC/JPCA-8435-2 Detail Specification for Right-angled Optical Board Connector Using Glass Fibers
Charlotte 郝宇
Translator/Technical Resources Assistant
IPC WOFE, a subsidiary of IPC, Inc.
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