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May 2007

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Subject:
Re: Solder terminal to polyimide PCB for mechanical strength
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask][log in to unmask]] För Vladimir Igoshev
Skickat: den 4 maj 2007 19:42
Till: [log in to unmask]
Ämne: Re: [TN] Metalurgists, need assistance

Hi inge,

There are no pictures :-)

Regards,

Vladimir

AMD

-----Original Message-----
From: TechNet
To: [log in to unmask]
Sent: Fri May 04 13:21:47 2007
Subject: [TN] Metalurgists, need assistance

Have an issue with (randomly) lifted FPGA leads.
Pic 1: good joint after pull test
Pic 2: ditto but high magnification
Pic 3: "rotten" joint after pull test
Pic 4: ditto but high magnification
Pic 5: "rotten" cross section
Pic 6: ditto but [...]45_4May200719:45:[log in to unmask]
Date:
Thu, 10 May 2007 15:37:48 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
Hi Jim,
I sure hope this is not an unsupported hole.
I would be more concerned with the strength of the soldering pad adhesion to 
the polyimide PCB than the solder to the pad.



Werner



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