LEADFREE Archives

May 2007

Leadfree@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
No soldermask between SQFP leads ok?
From:
Lothar Thole <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 21 May 2007 02:47:26 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
Thanks again to the responses to my question on asymmetric microBGA 
joints. 

Another question on land patterns if I may:

Our new leadfree assembler has requested us to modify our current 
SQFP Land Patterns by making the pads wider to allow for Side Fillets, 
thus improving the reliability of the solder joint. This will result in a 
situation where the 0.4mm (0.016in) pitch devices have a Pad-Pad 
spacing of 0.125mm (0.005in) with no dividing Soldermask. Our concern 
now is the possibility of Solder Bridging. Will the benefits of the side 
fillets outweigh the risks of bridging? Thanks in advance.

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------

ATOM RSS1 RSS2