IPC Global Design Conference:  Designing Better Today for Tomorrow - Calls 
for Participation
August 15, 16, 2007 - Toronto



OEM?s, fabricators,  and PCB designers are all working to optimize their 
products and processes  for lead free and design production. Let?s face 
it; the design of the PC  board starts with your designer, which affects 
the end product, and  ultimately affects the bottom-line. 

Engineers and  designers must consider new laminate materials, new 
component finishes,  new board finishes and the interactions between these 
materials and the  soldering and assembly process. Can you share solutions 
with the supply  chain?

IPC is seeking  speakers to participate in this global conference 
dedicated specifically  to keeping the designers informed and up-to-date 
on the issues being faced  in today?s industry. 

Conference Topics:  Abstracts for papers/presentations, educational 
courses, forums, or round  table discussions are sought, but NOT limited 
to the following  topics:

· Effective footprint  design (incl. BGAs)

· BGA assembly  /inspection

· Design for  EMC

· Electronics for the  PCB designer

· Designing for  Bluetooth technology

· Thermal design  considerations

· Design for  Manufacture/Design for Test

· Radio Frequency  Design Principles

· Via Plugging and  Other Protection

· HDI  technologies

· Assembly  Fabrication

· High Speed, High  Frequency & Signal Integrity 

· Embedded Passive  & Active Devices

· Impedance  control

· Black  Pad

· Standard  Activity

· CAD

· Electronic  Manufacturing Services

· Labeling

· Design for Lead  Free

· Environmental  Concerns

- RoHS & WEEE 

· IDF  Processes

· Test, Inspection  & AOI

· EMI

· Performance,  Quality & Reliability

This conference  offers time slots between 30-45 minutes long. To submit 
an abstract,  please complete the second page of this form and include an 
abstract of  200-300 words along with a brief biography or you may provide 
the same  information via e-mail to [log in to unmask] The deadline for 
abstract  submission is June 15, 2007. Full-length papers are optional, 
but  presentation materials are requested and will be due in electronic 
format  by July 23, 2007. Presentation materials must be non-commercial in 
nature,  focusing on technology rather than a company?s product. 

EDUCATIONAL  COURSES 

Proposals are also  solicited from individuals interested in teaching 
full-day tutorials (six  hours) or half-day workshops (three hours) to a 
class of up to 30 persons  on topics in these areas. An honorarium is 
offered to course instructors.  A brief description and additional 
information on any such proposal should  be submitted according to the 
guidelines for abstract  submission.

SPONSORSHIPS  AND TABLETOP EXHIBITS

Companies interested  in information on the benefits associated with IPC 
event sponsorship or  exhibiting in our tabletop exhibition, please email 
[log in to unmask]

REGISTRATION  INFORMATION

If you would like to  receive registration information on the IPC Global 
Design Conference when  available, please send your contact information to 
[log in to unmask] 

Proposed  Presentation

IPC Global  Design Conference:


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