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| Date: | Tue, 15 May 2007 13:56:47 -0400 |
| Content-Type: | multipart/mixed |
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----- Forwarded by Dennis Fritz/MacDermid/MACDERMID/US on 05/15/2007 01:51
PM -----
Becky Travelstead <[log in to unmask]>
05/15/2007 11:47 AM
To
[log in to unmask]
cc
Subject
New Studies for 2007--Embedded Components and TSV
New Studies for 2007
TechSearch International announces two new studies for publication in
2007:
Embedded Active Components and Integrated Passives: Technologies and
Markets and
Through Silicon Via Technology: the Ultimate Market for 3D Interconnect
The Embedded Components report is scheduled for June delivery and the
Through Silicon Via for Fall delivery.
The brochure detailing the preliminary contents for the Embedded study is
attached. Embedded actives and passives are being shipped in an
increasing number of IC packages and printed circuit boards (PCBs). This
report separates these activities into three segments for discussion:
o Integrated Passives in IC Package Substrates and Modules
o Embedded Active Components in IC Packages
o Buried Passives in Product Boards
Price: $4,995 (additional copies $500 each)
The preliminary brochure for our second study of 3D technologies, TSV 3D,
is also attached. This study highlights the major processes and materials
of through-hole silicon via (TSV) used by each company including via
fabrication methods, via filling, wafer thinning, and bonding methods.
Activities of research organizations and potential markets for 3D
integration with TSVs are discussed including drivers for adoption in each
application area.
Price: $4,000 (additional copies $400)
You may choose either paper or pdf format. Site licenses are also
available.
Please contact us at 512-372-8887 or [log in to unmask] you have
questions or need additional information.
Best regards,
Becky Travelstead
P.S. Also watch for our "Electronic Manufacturing in India" study due late
summer 2007.
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Becky Travelstead
Business Manager
TechSearch International Inc
Phone: 512-372-8887
Fax: 512-372-8889
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