Subject: | |
From: | |
Reply To: | (Designers Council Forum) |
Date: | Wed, 9 May 2007 08:15:00 -0700 |
Content-Type: | text/plain |
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The trace width I used
bottom layer same as BGA placement 5 mils
internal 5 mils, note: I fanned out in such way that I had routing
channels not all pins were used and I did have 3 rows of pins missing
all around close to the center of the device
The package is JEDEC MO-195, 384 pins
-Patrick
Fred Dark wrote:
> And the trace width...?
>
> -----Original Message-----
> From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
> Patrick Jabbaz
> Sent: Wednesday, May 09, 2007 10:35 AM
> To: [log in to unmask]
> Subject: Re: [DC] .5mm BGA fanout
>
> Mark,
> Very recently I had a .5mm BGA and I used micro vias all the way through
> top to bottom layer .060" thick board 6 layers only at the BGA location,
> I did check with the fab house and gave them the option of reducing the
> board thickness to .040" if necessary, I was told that no need for that
> they can do it in production run Taiwan.
> I used this size microvia
> hole size 5mils +2/-5
> Pad size 11.81 mils
>
> For the BGA Pad size I used Dia 0.25mm
>
>
> -Patrick
>
> Mark Eckert wrote:
>
>> Has anyone fanned out a .5mm bga with just micro vias and thru hole
>>
> vias?
>
>> or maybe without buried vias at all and with blind?
>> I have a 456pin bga, 5 rows on the outer and a 6x6 cluster in middle.
>>
>> Thanks,
>>
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>
> --
> Patrick Jabbaz
> Ubiquiti Networks
> 495-499 Montague Expwy
> Milpitas, CA 95035
> T: (408) 942-3085
> M: (408) 621-6533
>
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> information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
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--
Patrick Jabbaz
Ubiquiti Networks
495-499 Montague Expwy
Milpitas, CA 95035
T: (408) 942-3085
M: (408) 621-6533
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