"Soft" gold metallisations are solder compatible; that means that
after reflow soldering the gold content in the solder joint is less
than 3 w/w%.
"Hard" gold is used as a gold metallisation for end connectors pads
and touch pads. The thickness is 1.5 to 2 microns. The latter pads has
often carbon als pad finish.
Peer Langeveld
Soft Soldering Processes
Consultant
The Netherlands
2007/5/24, Dan Skweres <[log in to unmask]>:
> Question for you folks.... I'm aware of embrittlement issues with too much gold in solder joints. The question came up here whether or not there is a difference between "hard" gold content verses "soft" gold content? Thanks in advance!
> Dan
>
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