: <[log in to unmask]>
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: <[log in to unmask]>
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Not that I know of.
Not that I know of.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Randy Bock Sr.
Sent: Thursday, May 17, 2007 11:25 AM
To: [log in to unmask]
Subject: Re: [TN] BGA solderballs SAC105 Sanmina Report
Anyone getting multipule emails at the same time from the same person,
same subject ??? Steves did and now Scott's....
Randy Bock Sr.
Quality Engineer
Enterprise Quality Assurance
AddressRight Printers
(email) [log in to unmask]
Newtown Building 2
203 270-4931 Ext
8-426-4931 In
203 270-4982 Fax
This e-mail message may contain confidential, proprietary and/or
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Thank You.
Scott Lefebvre <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
05/17/2007 02:12 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Scott Lefebvre <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] BGA solderballs SAC105 Sanmina Report
: <[log in to unmask]>
: <[log in to unmask]>
X-NAI-Spam-Level:
Here is an article I found that Sanmina wrote that I thought would be of
interest to all concerning SAC105.
http://www.sanmina-sci.com/partners/QAR-0009-C.pdf
Scott Lefebvre
-----Original Message-----
From: Stadem, Richard D. [mailto:[log in to unmask]]
Sent: Thursday, May 17, 2007 6:28 AM
Subject: Re: Changing BGA solderballs from SAC405 to SAC105
Ioan,
Where are these studies showing that soldering of LF BGAs with leaded
solder is a good practice? Can you post a link?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Thursday, May 17, 2007 6:58 AM
To: [log in to unmask]
Subject: Re: [TN] Changing BGA solderballs from SAC405 to SAC105
Well Phil,
I haven't really been following this, but I am worried. We already have
too many customers asking us to solder LF BGAs with leaded solder and
the deal was to get the BGA balls to melt, at around 220C. I was happy
that studies started to surface showing this was good practice and the
result was reliable.
How will I be able to solder the SAC105 with leaded? And we already have
an inspector full time on the XRF, just to make sure Pb is not there.
Now I will have to ask them to measure the composition of the balls...
When will it end?
Just my concerns!
Ioan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phillip Bavaro
Sent: Wednesday, May 16, 2007 8:31 PM
To: [log in to unmask]
Subject: [TN] Changing BGA solderballs from SAC405 to SAC105
I haven't been following the transition to use SAC105 so I would
appreciate any advice those of you who have already gone down this path
might have.
SAC405 and SAC305 was considered compatible with our SAC305 paste, but
now there is a component which is changing the solderballs to SAC105.
SAC105 has a higher liquidus temperature (226 C) than SAC305 (217 C) .
Is this going to impact our assembly processes?
Does it only tighten up the reflow process window?
Is this transition something that the majority of manufacturers of
components are going to undertake soon?
Thanks in advance,
Phil
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