In a message dated 5/10/2007 1:49:10 P.M. Eastern Daylight Time,
[log in to unmask] writes:
(2) that the use of a Pb-free tinned part is
okay if a tin-lead solder process is used for the junction (with the
exception of Pb-free BGA devices) - correct? That is, as far as tin whiskers
go...
Well, "it depends"
You are assuming the eutectic solder wets all the component lead of the
"Pb-free tinned part". If the eutectic does not wet completely, you will have a
tin rich region, and possibly whiskers.
Why would you tin with Pb-free? Just tin with Eutectic if you are soldering
with eutectic. Granted, fusing tin component finishes is a mitigating
process in itself.
Denny Fritz
SAIC
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