Dear all,

It is the sidetrack information.  For the chip pad, the presence of the
sufficient clearance (e.g. 75um) can be helpful to reduce the MCB (Mid chip
solder ball) for the paste application. It is the field experience

Regards,

Jackson

Cookson Electronics - Alpha Metals
Technical Services Manager



                                                                           
             Johnny Chen                                                   
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                                                                   Subject 
             28/05/2007 20:13          [TGA] Solder mask clearance around  
                                       the lands                           
                                                                           
             Please respond to                                             
               Asia Committe                                               
             Task Group Forum                                              
             <[log in to unmask]>;                                             
             Please respond to                                             
                Johnny Chen                                                
             <[log in to unmask]                                             
              LEXTRONICS.COM>                                              
                                                                           
                                                                           




Dear all,

Would you please advise which IPC defines the solder mask clearance around
the lands for NSMD land pattern?

(Embedded image moved to file: pic00041.jpg)

Thanks & best regards,
Johnny
- Process Engineering
Creating Value That Increases Customer Competitiveness


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