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Wed, 9 May 2007 07:35:17 -0700 |
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Mark,
Very recently I had a .5mm BGA and I used micro vias all the way through
top to bottom layer .060" thick board 6 layers only at the BGA location,
I did check with the fab house and gave them the option of reducing the
board thickness to .040" if necessary,
I was told that no need for that they can do it in production run Taiwan.
I used this size microvia
hole size 5mils +2/-5
Pad size 11.81 mils
For the BGA Pad size I used Dia 0.25mm
-Patrick
Mark Eckert wrote:
> Has anyone fanned out a .5mm bga with just micro vias and thru hole vias?
> or maybe without buried vias at all and with blind?
> I have a 456pin bga, 5 rows on the outer and a 6x6 cluster in middle.
>
> Thanks,
>
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--
Patrick Jabbaz
Ubiquiti Networks
495-499 Montague Expwy
Milpitas, CA 95035
T: (408) 942-3085
M: (408) 621-6533
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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