Before even trying to rely on the water break test, I suggest you may 
care to read the peer-reviewed paper I presented in Circuit World, 
Volume 35, Number 4, 2005. pp 47-50, entitled "The Water Break Test". 
This will explain that there are a number of fallacies involved, when 
relying on such empirical methods. The main one is that the test will 
succeed only on contaminated surfaces.

Brian

Marsico, James wrote:
> Hello Technet:
> 
>  
> 
> We have an application where we have to etch a PTFE PWB in preparation
> for bonding.   The etch is a commercially available sodium-containing
> solution.  We're also expected to meet a water-break test prior to
> bonding.  We're having trouble meeting the water-break test and was
> wondering if the two (etched PWB and water-break) are compatible.  If
> so, what cleaning/rinsing could be performed after the etching to ensure
> a water-break free surface?
> 
>  
> 
> Thanks in advance,
> 
>  
> 
> Jim Marsico
> 
> EDO Corporation
> 
> Amityville:  631-630-5079
> 
> Bohemia:  631-218-7057
> 
> [log in to unmask]
> 
>  
> 
> 
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