Joe,

Not all x-ray machines are created equal.  At a previous company, I was 
extremely successful at seeing opens / poor wets with the X-Tek Orbita 
x-ray machine.  I had a solder joint that is sometimes described as 
"foot-in-mud" or "head-in-pillow".  Tried several x-ray 
machines/technologies, but at that time (about 2 years ago), only the 
X-Tek at about a 55-degree angle was able to see the "foot-in-mud".

We were so impressed with the X-Tek, that we bought and placed a 2nd 
machine at our contract manufacturer.

Contact me if you need more details.

Al Kreplick
Sr. Manufacturing Engineer
Circuit Card Assembly
Air-toAir/Precision Strike/Land Combat
Raytheon Integrated Defense Systems
978-470-9931office
978-245-1702 pager
978-470-4307 fax
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"Kane, Joseph E (US SSA)" <[log in to unmask]> 
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04/06/2007 02:45 PM
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Subject
[TN] Inspection Under BGA's






Just wondering if there are any new and useful non-destructive 
ways of finding open connections or poor wets deep under area array
packages.

We've tried a number of different x-ray technologies, including tricks 
with angles, and scanned beam laminography, without much success. 
And those optical methods, like prisms or ErsaScope, are pretty good at 
seeing the outermost rows, but we may lack the talent or technique to
be able to see much deeper.

It would be nice to snake in some thin fibers, maybe a few to carry the
light, and another one for the image, like a boroscope.  Anybody got 
anything like that?

Joe Kane
BAE Systems
Johnson City, NY

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