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April 2007

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Subject:
From:
"Bloomquist, Ken" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bloomquist, Ken
Date:
Thu, 5 Apr 2007 14:54:16 -0700
Content-Type:
text/plain
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text/plain (234 lines)
Oh I get it, just like it sounds, thank you!

KennyB


-----Original Message-----
From: Dwight Mattix [mailto:[log in to unmask]] 
Sent: Thursday, April 05, 2007 2:29 PM
To: [log in to unmask]
Subject: Re: [TN] Thermal via's on D2PAK

sanded flat.


At 02:11 PM 4/5/2007, Bloomquist, Ken wrote:
>Hi Kerry,
>
>Could you please explain "planarized"? That's not a term I'm familiar
>with.
>
>Thanks,
>
>KennyB
>
>
>-----Original Message-----
>From: Kerry McMullen [mailto:[log in to unmask]]
>Sent: Thursday, April 05, 2007 10:51 AM
>To: [log in to unmask]
>Subject: Re: [TN] Thermal via's on D2PAK
>
>You can also have the vias plugged with a non conductive filler (Peters
>does well) and have it planarized prior to plating.   Works well.
>
>Kerry McMullen
>Principal New Product Mfg. Engineer
>LTX Corporation
>825 University Avenue
>Norwood, MA 02062-2643
>(T) 781-467-5468
>(C) 508-631-1832
>(F) 781-461-0993
>
>
>
>Barbara Burcham <[log in to unmask]>
>Sent by: TechNet <[log in to unmask]>
>04/05/2007 12:03 PM
>Please respond to
>TechNet E-Mail Forum <[log in to unmask]>; Please respond to
>Barbara Burcham <[log in to unmask]>
>
>
>To
>[log in to unmask]
>cc
>
>Subject
>Re: [TN] Thermal via's on D2PAK
>
>
>
>
>
>
>I use vias, too.
>The vias should be as small as possible.
>I use solder paste dots between the via holes so that the solder is not
>sucked down the holes in reflow.
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Frank Kimmey
>Sent: Thursday, April 05, 2007 10:51 AM
>To: [log in to unmask]
>Subject: Re: [TN] Thermal via's on D2PAK
>
>Kenny,
>There are lots of issues to deal with when placing vias under any
>soldered component.
>We almost always use thermal vias under hot parts to help.
>
>You will need to calculate a few items prior to completing layout.
>1. PCB thickness (higher aspect ratio helps reduce bleed through)
>2. Via diameter (larger vias allow more solder to flow through the PCB)
>3. Solder availability (solder starvation beneath the part can be an
>issue)
>4. Final finish and solder process (again, how much solder will go down
>the holes)
>5. How to keep the backside from being a mess
>
>Call me if you want to discuss in further detail.
>Hope it helps,
>FNK
>
>Frank N Kimmey CID+
>Principal PCB Designer
>PCB Programs
>Powerwave Technologies Inc
>Office 916-941-3159
>Fax 916-941-3195
>Mobile 916-670-0645
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Bloomquist, Ken
>Sent: Thursday, April 05, 2007 8:43 AM
>To: [log in to unmask]
>Subject: [TN] Thermal via's on D2PAK
>
>Do any of you see an issue with putting thermal via's under the bodies
>of a D2PAK? Do you have any recommendations for the number or size or
>the via's to help transfer heat to the other side of the board?
>
>Thanks,
>
>KennyB
>
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