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April 2007

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Thu, 5 Apr 2007 10:34:31 -0400
Content-Type:
text/plain
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text/plain (98 lines)
	Vladimir:
	         Has TI made the process improvements in the Paladium
thichness at its optimum so that solder joint is more reliable and
easier to obtain?
	Regards,
	Ramon
	 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Thursday, April 05, 2007 9:57 AM
To: [log in to unmask]
Subject: Re: [TN] NiPdAu FINISH

Hi George,

Pb doesn't form any intermetallics with Au (or Ni, or Cu for that
matter) either. :-) 

Pd and Sn might a problem if a layer of Pd is too thick.

Regards,

Vladimir

AMD

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of George Milad
Sent: Thursday, April 05, 2007 9:46 AM
To: [log in to unmask]
Subject: Re: [TN] NiPdAu FINISH

Ni/Pd/Au makes relatively weak solder joint with Sn/Pb eutectic  solder.
This is caused by the incompatibility of Pd with the Pb component of the

solder.
Pd and Pb do not form an intermetallic.
 
The good news is Ni/Pd/Au makes a very robust solder joint with SAC
alloy  or lead free solder.
 
The details were published in the Apex proceedings of 2006.
 
Regards
George Milad
George Milad
National Accounts  Manager for Technology Uyemura International Corp
(UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901  3874



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