When the NiPdAu finish first came out, we had many TI components failing
because the plating was peeling off of the basis metal on the gullwing
component leads after they were soldered. The solder would "wet" to the
leads just fine, but you did not have a good mechanical connection due
to the plating not properly adhering to the leads themselves. Over the
years, I have seen reliability issues with TI NiPdAu plating at
different companies I worked for. It was often manifest as fractured
leads, where the lead is actually still in the solder joint but
fractured and separated from the solder fillet itself (sitting in the
saddle, but no electrical connection). The solder joint was always well
wetted to the board pad, but wherever it made contact with the lead it
would be separated. You could see the thin flake of plating still in the
solder joint, but the lead was a dark gray color where the plating broke
off.
I don't like soldering TI components.
We tried several times to convince TI that their part plating was
defective, including sending the parts to metallurgical labs for
analysis where the plating issues were analyzed. TI did not return our
calls, did not want to even discuss the problem. They just kept sending
one "validation report" after another back to us. They told us our
solder profile was incorrect.
I don't like soldering TI components.
I never did figure out what was wrong with the solder profiles at four
different companies such that they were able to solder every single
component on hundreds of different assembly types without any problems,
yet only the TI parts with this particular finish had this issue.
I don't like soldering TI components.
If you look back on the TI threads in the archives, you will see that
many others had the same issues with these parts with this finish.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of BADRI
Sent: Wednesday, April 04, 2007 10:33 PM
To: [log in to unmask]
Subject: Re: [TN] NiPdAu FINISH
Robert,
We have assembled some boards with SnNipdAu component. The component was
a QFP. We had heavy solderability issues on the reflow.The joint takes a
bump formation. Hand soldering was not an issue. I have infact posted
the same query last week in technet and the response was minimal.
Thanx
Badri
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
Sent: Thursday, April 05, 2007 3:02 AM
To: [log in to unmask]
Subject: [TN] NiPdAu FINISH
Has anyone had an issue with TSSOP-xx pin packages (with NiPdAu lead
finish) in the ability to solder using a normal SnPb solder both for SMT
reflow and/or hand solder? Thanks in advance, Jon
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