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Date: | Wed, 4 Apr 2007 22:28:04 +0200 |
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A lot of interesting topics!
http://www.cmap.ca/open/ic_confprogram_details06.htm
Stacked Modular Packages, what way?
Inge
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Från: TechNet [mailto:[log in to unmask]] För Werner Engelmaier
Skickat: den 4 april 2007 21:34
Till: [log in to unmask]
Ämne: [TN] Reference info needed
Hi 'Netters,
Ineed the reference information for 2 papers:
(1) Bagheri, S., et al, (IBM) “Solder Joint Microstructure and
Reliability
Study of Ceramic Ball Grid Array (CBGA) Components,” ???
(2) Pienimaa, S., et al, (Nokia), “Stacked Modular Package,” ???
Werner
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