Currently I have been using ENIG as my primary lead free solder finish
but I've been reading about Direct Immersion Gold "DIG".  Direct
immersion gold is deposited directly on the copper surface to a
thickness of 1-2 uins.  I want to know if anyone in Technet has any
experience with this finish.

 

I use both water soluble solder and no clean solder flux in our current
process.  The lead free solder is SAC305 for both SMT and through-hole.

 

One of the drawbacks I could think of is copper dissolution when
soldering the boards with SAC305 solder.  I have not had any issues
using our existing ENIG solder finish but one of our new PCB shops have
asked if we could switch.

 

Scott Lefebvre


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------