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April 2007

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Subject:
From:
Gary Camac <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gary Camac <[log in to unmask]>
Date:
Mon, 30 Apr 2007 14:03:07 -0500
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text/plain
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Iaon,

Concerning your second bullet point, I successfully tested a SN100C
paste from AIM last year.

Gary Camac 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Monday, April 30, 2007 1:42 PM
To: [log in to unmask]
Subject: [TN] SN100C vs. SAC305

Dear Technos,

I need to know how is this combat evolving. This topic has been brought
up several times, but things change fast right now and there must be
more empirical data on the matter.

What I know regarding the 2 materials can be summarized:

*	Pro SN100C: cheaper, better looking, eats less copper in the TH
*	One major unknown - the Reliability: SN100C is not available in
solder paste format, therefore the boards would have SAC SMT joints and
SN100C TH joints. This means 2 different materials and since we don't
know how reliable a board with only one material is, should we risk
introducing an extra variable?

I would like to know what your take is. Does anybody mixes the 2
materials? Any reliability testing done? How long have you been doing it
and do you see RMAs?

Thanks,

Ioan


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