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April 2007

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From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 27 Apr 2007 09:14:45 -0500
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Hi Inge! Sorry for this soapbox but I would like to get your "definitions" 
tuned up a bit. The term "solderability" is the wettability of a metal 
surface to be wetted with a solder alloy. All metallic surfaces have a 
characteristic solderability value. The term "soldering-ability" is the 
ability to form a solder joint for a specified set of solder process 
parameters. You would conduct a solderability test (I hope per JSTD-002) 
to confirm that the component surfaces are wettable by solder under a 
specified set of parameters. You would conduct a soldering-ability test to 
confirm that a printed wiring assembly design in a specified soldering 
process parameter set with produce acceptable solder joints. The JSTD-002 
committee runs into this "term confusion" all the time. Everyone should be 
able to run a solderability test on a test sample and get the same results 
since we all use the same test parameters/procedure. Everyone will most 
likely NOT get the same answer for a soldering-ability test because of a 
company's flux material, temperature capabilities, and equipment parameter 
differences. In your case below, you had good solderability (I am assuming 
you had good wetting) but terrible soldering-ability (gold embrittlement 
of the solder joints). Good luck on educating the internal customer.

Dave Hillman
Rockwell Collins
[log in to unmask]




Hernefjord Ingemar <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
04/27/2007 07:25 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Hernefjord Ingemar <[log in to unmask]>


To
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Subject
Re: [TN] solderability testing






 Hi Steve and you all,
Talking solderability. There are many ways. One of our design engineers
wanted to know about the solderability of his new design. Kind of
aluminum carriers for soldering on Teflon boards. I asked for the
respective finish on the two parts. Board was IAg which looked
acceptable. The aluminum part had Gold over Copper directly on the
aluminum. No barrier, too much Gold.  Hmmmm..I took one board full of
soldered parts and knocked twice against the desk, then bent the board
slightly. One third of the components dropped off with a pinging sound.
A solderability test in practice. My internal customer looked little
sad, but I felt this was best way to make him understand that he had to
learn about plating. I use various such methods, and seldom use balance
or even dip.

Inge

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: den 25 april 2007 14:18
To: [log in to unmask]
Subject: Re: [TN] solderability testing

Steve,
You and others are in a different world than some of us other solder
rats.  Here parts are usually bought in advance so there is time to get
new lots if things are bad.  Now we are not doing incoming inspection on
everything that comes in - just new components and components that come
from an occasional disty (maybe they stored them under a tarp in
Louisiana during Katrina for all I know!).  We could not afford to have
people touching a soldering iron to every circuit pack going down the
line - we make thousands every day - not practical in our case.

The problem is getting suppliers to believe wetting balance results!
And as George said, the best test is soldering them on-line! And it is
the ONLY test where you can get any real stats.

Just a different perspective.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, April 25, 2007 8:09 AM
To: [log in to unmask]
Subject: Re: [TN] solderability testing

Morning George!

Very lucid answer! Most places I've worked at have been contract
assembly companies, and most have not had the resources nor the trained
people to conduct component solderability tests on everything. For one
thing, most material that we receive is JIT and scheduled to be
assembled on a board within just a few weeks if not days. Sometimes we
HAVE to use material that may not surprise us to have solderability
problems because of the availability of certain parts that are on our
customers B.O.M.'s. We don't like to go to gray market component
brokers, but sometimes we have to when you can't find the parts anywhere
else and there's no other alternates. We always let our customers know
about this when it happens and let them make the call...they usually
tell us to get the parts wherever we can.

So what do we do when have parts with marginal solderability? We deal
with it, plain and simple. A lot of labor and soldering irons can do
wonders. Sometimes when we've been burned in the past with certain parts
we'll send them out for pre-tinning before assembly. Our customers
expect us to do that. I would hate to think what would happen if we
called one of our customers and told them that their ship schedule was
going to slip because a part didn't pass a solderability test at
receiving.

-Steve Gregory- 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Wednesday, April 25, 2007 5:23 AM
To: [log in to unmask]
Subject: Re: [TN] solderability testing

Is there a perfect solderability test?  Well let me Liang Yin,

Is there a perfect solderability test?  Well let me use Doug Paul's line
and say "that depends".  Having worked with Lee at the AT&T facility at
Richmond and spent many years running the Bell Labs Engineering Research
Center FMA Lab I've found the best solderability test to be the actual
soldering process.  I'm amazed how many times solder assembly engineers
would come or send components to the lab with components they say "don't
solder well" and would like me to test the solderability.  My first
comment is that they already tested the solderability when they tried to
solder the component.  If we were pressured into actually running a
solderability test in the lab and they wanted an answer immediately we
would run a Dip-&-Look solderability test like described by Greg Munie a
week ago in another TN response.  If the person we were doing the
solderability test for had to have a quantifiable value we would run a
wetting balance solderability test.  If the person we were doing the
solderability test for didn't believe the Dip-&-Look or wetting balance
results because they were like wave soldering (i.e., components dipped
into molten solder) and the components they were using were being
assembled by reflow surface mount soldering than we'd run the test that
Bev Christian recommends (i.e., simulated surface mount solderability
test). 

The short answer is that the "Perfect Solderability Test" is the
actually soldering process.

Regards,
George
George M. Wenger
Andrew Corporation Wireless Network Solutions Senior Principal FMA /
Reliability Engineer 40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office]  (732) 309-8964 [Cell] -----Original
Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Liang Yin
Sent: Wednesday, April 25, 2007 12:04 AM
To: [log in to unmask]
Subject: Re: [TN] solderability testing

Lee,

Just follow up on your comment below, is there a perfect test for
solderability? 

Thanks,

Liang Yin
Process Research Engineer
Unovis-Solutions
Binghamton, NY


On Mon, 23 Apr 2007 10:39:46 -0400, Lee parker <[log in to unmask]> wrote:

>Ioan
>
>At the AT&T facility in Richmond, we did both. The results were nearly 
>always in close agreement. Since the dip and look test was far easier
to
>execute and could be performed by someone with less training, we
elected to
>use the dip and look procedure. Unfortunately, neither method is
perfect.
>
>Best regards
>
>Lee
>
>J. Lee Parker, Ph.D.
>JLP Consultants LLC
>804 779 3389
>
>
>
>
>
>----- Original Message -----
>From: "Tempea, Ioan" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Monday, April 23, 2007 10:12 AM
>Subject: [TN] solderability testing
>
>
>Hi Technos,
>
>I need to setup a sort of solderability testing process.
>
>J-STD-002 is pretty clear, but I would like to know how are you set up
for
>the job. Mainly I would like to be able to make a decision on dip and
look
>OR wetting balance?
>What kind of equipment are you using?
>How to make the tests less of a black magic and more of a repeatable 
>process, with easy to interpret results?
>
>Thanks,
>
>Ioan
>
>
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