TECHNET Archives

April 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Dwight Mattix <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dwight Mattix <[log in to unmask]>
Date:
Thu, 26 Apr 2007 10:10:54 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (132 lines)
word of caution here... I have accumulated some scar tissue on this topic.

While we typically allow this with our qualified suppliers, this shouldn't 
granted just so fabricators can get sloppy in plating setup (i.e. crankup 
ASF, pay too little attention to mitigating effects of of high/low current 
density areas, etc.).

If by "plated shut" you mean "substantially filled" then yes -- 
fine.  However BEWARE of entrapment.

We have had vias plate shut at the knee that had sufficient air/moisture 
entrapped to blow off pad/delaminate surface copper during reflow.  Gnd 
areas of tightly packed thermal via farms are especially susceptible to 
this lifting (get that many vias blowing out together and it generates 
significant stresses).

dw



At 09:44 AM 4/26/2007, Ryan Grant wrote:
>I agree with John, that I don't mind the via being plated shut.  (Don't
>place more restrictions on the fabricator than necessary).  HOWEVER,
>that should not be confused with a via being closed off by debris or
>nodules and then plated over, making it appear plated shut!  If anything
>blocks that via during plating, the inside of the via will not be
>sufficiently plated and will cause latent open failures.
>
>-Ryan
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of John Foster
>Sent: Thursday, April 26, 2007 9:37 AM
>To: [log in to unmask]
>Subject: Re: [TN] "plated shut vias"
>
>I am a printed circuit board designer and I will tell you that
>quite often when I am speaking to a fabricator and I need to take
>the vias way down say 8 mils or below the first thing I hear from the
>fabricator is "Is it okay if the vias are plated shut"
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of David Greig
>Sent: Thursday, April 26, 2007 8:39 AM
>To: [log in to unmask]
>Subject: [TN] "plated shut vias"
>
>
>Hi List,
>
>Yet again I've come across fabrication notes on other pcb designers
>notes that specify that thru board via's may be plated shut.
>
>Is there any historical reason for this, or is it just hysterical?
>
>I would be rather concerned to see a closed via that is neither blind or
>filled, mental images of trapped process chemistry etc.
>
>Best Regards
>
>David Greig
>______________________________
>
>GigaDyne Ltd
>5 Albany Business Centre
>Gardeners Street
>Dunfermline KY12 0RN
>United Kingdom
>t: +44 (0)1383 624 975
>www.gigadyne.co.uk
>______________________________
>
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 15.0
>To unsubscribe, send a message to [log in to unmask] with following text
>in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt or (re-start) delivery of Technet send e-mail to
>[log in to unmask]: SET Technet NOMAIL or (MAIL)
>To receive ONE mailing per day of all the posts: send e-mail to
>[log in to unmask]: SET Technet Digest
>Search the archives of previous posts at:
>http://listserv.ipc.org/archives
>Please visit IPC web site
>http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
>information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
>ext.2815
>-----------------------------------------------------
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 15.0
>To unsubscribe, send a message to [log in to unmask] with following text
>in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt or (re-start) delivery of Technet send e-mail to
>[log in to unmask]: SET Technet NOMAIL or (MAIL)
>To receive ONE mailing per day of all the posts: send e-mail to
>[log in to unmask]: SET Technet Digest
>Search the archives of previous posts at:
>http://listserv.ipc.org/archives
>Please visit IPC web site
>http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
>information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
>ext.2815
>-----------------------------------------------------
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 15.0
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt or (re-start) delivery of Technet send e-mail to 
>[log in to unmask]: SET Technet NOMAIL or (MAIL)
>To receive ONE mailing per day of all the posts: send e-mail to 
>[log in to unmask]: SET Technet Digest
>Search the archives of previous posts at: http://listserv.ipc.org/archives
>Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 
>for additional information, or contact Keach Sasamori at [log in to unmask] or 
>847-615-7100 ext.2815
>-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2