PCB Laminate Materials and the RoHS Change: IPC-4101 Specification,
Bromine Free and Reliability 
June 26, 2007 - Bannockburn, IL - Instructor:  Doug Sober

This workshop will address laminate and prepreg materials with a special
focus on the grades, properties, testing and composition necessary for
lead free assembly. All grades of base materials used in printed boards
from low-cost, paper-based (FR-1) to high-speed/high-frequency PTFE will
be analyzed in depth in this course. Manufacturing processes and
strategic building blocks for conventional prepreg and laminate
production will be also introduced. An overview of current markets for
these materials will be discussed.

Final Finishes and their Compatibility with Lead Free Soldering
June 27, 2007 - Bannockburn, IL - Instructor:  Michael Carano

The electronics industry is moving rapidly to lead free soldering. There
are also additional requirements for solderable finishes protecting the
bare copper prior to assembly. In addition to coplanarity and lead free,
these surface finishes provide the optimum (lead free) solder paste
spreadability and lead free solder through-hole fill for optimum joint
strength. Higher temperature melting points for lead free solders will
add additional heat stress and aging. How will this impact solderability
and long-term reliability? Attend this workshop and find out. Learn what
fabricators must do to be successful with lead free finishes. Assembly
personnel will gain better insight into managing the transition to lead
free soldering using lead free surface finishes. 

To register for either of these informative workshops, please cut and
paste www.ipc.org/PCB&FF07 into your browser and download the
registration form.

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