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April 2007

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Subject:
From:
John Burke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Burke <[log in to unmask]>
Date:
Thu, 26 Apr 2007 08:23:47 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (341 lines)
I think he went on to a career in environmental politics in the
EU............8-)

 
 
John Burke
 
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Wednesday, April 25, 2007 5:31 PM
To: [log in to unmask]
Subject: Re: [TN] NTC solderability testing

Why did you waste those perfectly good epoxy terminated co
John,

Why did you waste those perfectly good epoxy terminated components by
processing them down your line?  Are you really sure your profile was
correct?  If you weren't sure or if you Design Engineer wasn't convinced
after processing them down your line he should have taken them to the
laboratory and had them run a solderability test.  Then he would know
for sure if they were solderable.  If Design Engineer ever had to run a
soldering process he would quickly learn that "cheaper and available"
components are usually cheaper and available because there is something
wrong with them (e.g., they don't work or they are not solderable).

Regards,
George
George M. Wenger
Andrew Corporation Wireless Network Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office]  (732) 309-8964 [Cell]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, April 25, 2007 7:54 PM
To: [log in to unmask]
Subject: Re: [TN] NTC solderability testing

So, there I was 10 years ago, the design engineer had chosen a new part
which the purchasing guy had asked him to use because it "was cheaper
and
available"

At the time I was running production for Psion in Greenford London.

We put a panel of Psion series 3's down the line as a quick test and
looked
at the result - I smiled at what I saw and called the engineer down to
the
line, and told him that the components were not solderable.

To which he replied "of course they are it must be your profile"!

Still smiling I led him to a soldering station equipped with the latest
Metcal technology, gave him a strip of parts and suggest he try
soldering
them.

After several frustrated attempts at getting them to wet, I gently
informed
him that the parts he had diligently signed off on were in fact
terminated
with conductive epoxy and designed to be connected using the same
material.................8-)

John
 
 
John Burke
 
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Wednesday, April 25, 2007 5:10 AM
To: [log in to unmask]
Subject: Re: [TN] solderability testing

	George:
	How many books did Dr. Liang Yin write? If he is a well know
fellow, how is it that we have not heard about him? He.
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: Wednesday, April 25, 2007 6:23 AM
To: [log in to unmask]
Subject: Re: [TN] solderability testing

Is there a perfect solderability test?  Well let me Liang Yin,

Is there a perfect solderability test?  Well let me use Doug Paul's line
and say "that depends".  Having worked with Lee at the AT&T facility at
Richmond and spent many years running the Bell Labs Engineering Research
Center FMA Lab I've found the best solderability test to be the actual
soldering process.  I'm amazed how many times solder assembly engineers
would come or send components to the lab with components they say "don't
solder well" and would like me to test the solderability.  My first
comment is that they already tested the solderability when they tried to
solder the component.  If we were pressured into actually running a
solderability test in the lab and they wanted an answer immediately we
would run a Dip-&-Look solderability test like described by Greg Munie a
week ago in another TN response.  If the person we were doing the
solderability test for had to have a quantifiable value we would run a
wetting balance solderability test.  If the person we were doing the
solderability test for didn't believe the Dip-&-Look or wetting balance
results because they were like wave soldering (i.e., components dipped
into molten solder) and the components they were using were being
assembled by reflow surface mount soldering than we'd run the test that
Bev Christian recommends (i.e., simulated surface mount solderability
test). 

The short answer is that the "Perfect Solderability Test" is the
actually soldering process.

Regards,
George
George M. Wenger
Andrew Corporation Wireless Network Solutions Senior Principal FMA /
Reliability Engineer 40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office]  (732) 309-8964 [Cell] -----Original
Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Liang Yin
Sent: Wednesday, April 25, 2007 12:04 AM
To: [log in to unmask]
Subject: Re: [TN] solderability testing

Lee,

Just follow up on your comment below, is there a perfect test for
solderability? 

Thanks,

Liang Yin
Process Research Engineer
Unovis-Solutions
Binghamton, NY


On Mon, 23 Apr 2007 10:39:46 -0400, Lee parker <[log in to unmask]> wrote:

>Ioan
>
>At the AT&T facility in Richmond, we did both. The results were nearly 
>always in close agreement. Since the dip and look test was far easier
to
>execute and could be performed by someone with less training, we
elected to
>use the dip and look procedure. Unfortunately, neither method is
perfect.
>
>Best regards
>
>Lee
>
>J. Lee Parker, Ph.D.
>JLP Consultants LLC
>804 779 3389
>
>
>
>
>
>----- Original Message -----
>From: "Tempea, Ioan" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Monday, April 23, 2007 10:12 AM
>Subject: [TN] solderability testing
>
>
>Hi Technos,
>
>I need to setup a sort of solderability testing process.
>
>J-STD-002 is pretty clear, but I would like to know how are you set up
for
>the job. Mainly I would like to be able to make a decision on dip and
look
>OR wetting balance?
>What kind of equipment are you using?
>How to make the tests less of a black magic and more of a repeatable 
>process, with easy to interpret results?
>
>Thanks,
>
>Ioan
>
>
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