Hi Ron,
You might also try to "push" the packages into solder paste after
placement. It did work when we had a similar problem (with a different
type of component, though).
Regards,
Vladimir
AMD
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Thursday, April 26, 2007 11:12 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights
Great Idea. If the paste is increased and an extra solder mask
for the BGA pads is manually added to dam the paste from shorting out
to other pads. The extra solder mask needs to be just thick enough to
allow the solder balls to go in and touch the pads.
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bill Kunkle
Sent: Thursday, April 26, 2007 10:37 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights
Ron,
Perhaps printing different amounts or thicknesses of paste across the
BGA would help.
Please email offline to discuss.
Bill Kunkle
MET Assocs
609 261 2670
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Ron Peeler
Sent: Thursday, April 26, 2007 8:38 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights
Bev,
You are completely right. This product that I have been "baptized" into
has been a 4 year terror. I am probably the 8th set of eyes to look at
it. I have seemed to make the most progress but that doesn't mean a
thing. All I do know is that the design is not good, the parts are
obsolete and the board is already being produced in a new generation
build, so basically I am stuck with what I have. Even though scrap is
high on this board, they just want to pump them out till they fizzle
out. So I am stuck with trying to find a reliable way to solder these
BGA's when in 4 years they haven't been able to on this board. I know
that the warping on the board is causing the issue in conjunction with
the uneveness of the BGA package, neither of which can be changed.
Ronald D. Peeler Jr., B.S. IE
Process Engineer
SWEMCO
Moorestown, NJ 08057
Tel: (856).222.9900 ext. 31
Cel: (484).948.0779
Fax: (856).222.0700
[log in to unmask]
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Wednesday, April 25, 2007 4:58 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights
Ron,
The problem right now is you see an effect and you do not know the
cause. It could be that the board and/or component warps and you have
opens. It could be that you have a head-in-pillow situation. It could
be that you have internal component opens. It could be that you have
cracked solder joints. You have to figure out which it is before you
try to apply a remedy.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ron Peeler
Sent: Wednesday, April 25, 2007 4:38 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights
Don't try me I just might ask you that...
:)
Ronald D. Peeler Jr., B.S. IE
Process Engineer
SWEMCO
Moorestown, NJ 08057
Tel: (856).222.9900 ext. 31
Cel: (484).948.0779
Fax: (856).222.0700
[log in to unmask]
-----Original Message-----
From: Wayne Thayer [mailto:[log in to unmask]]
Sent: Wednesday, April 25, 2007 4:35 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights
Hi Ron!
I think most people solve this problem by making sure the board and BGA
are planar during the process, and that the solder paste is thick enough
to make up the difference. Then you have the "collapse" process working
for you too.
Weights can be used but are painful--last resort. They absorb heat,
messing up the solder profile, and need to be fixtured so they don't
fall off during reflow.
Next you are likely to ask for a rule of thumb for the pressure
supportable by the solder surface tension and the compression of the
solder balls which ensues. I don't know that--I just try weights until
it works.
Wayne Thayer
>>> [log in to unmask] 4/25/2007 4:23:12 pm >>>
Hello TechNet
I was wondering is there anything in the industry that is used to weigh
BGA's down? We are having an issue @ our shop with BGA's not soldering
effectively to one of our boards. Currently we have a board that is
suppose to go through a boot process, however it has problems doing so.
The issue is resolved when you press down in the middle of the BGA and
fails again once the BGA is released. It doesn't help that our board
warps easily as well. Is there anything, small gram weights or so that
can weigh down a BGA without shorting it?
Thanks
Ronald D. Peeler Jr., B.S. IE
Process Engineer
SWEMCO
Moorestown, NJ 08057
Tel: (856).222.9900 ext. 31
Cel: (484).948.0779
Fax: (856).222.0700
[log in to unmask]
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential
information, privileged material (including material protected by the
solicitor-client or other applicable privileges), or constitute
non-public information. Any use of this information by anyone other than
the intended recipient is prohibited. If you have received this
transmission in error, please immediately reply to the sender and delete
this information from your system. Use, dissemination, distribution, or
reproduction of this transmission by unintended recipients is not
authorized and may be unlawful.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing
per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
