Hi Ron!
I haven't run into a problem such as your, so I feel for ya'...
Maybe turning the parts into CGA's might help? Take a look at this:
http://sixsigmaservices.com/columnattach.asp
-Steve Gregory-
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ron Peeler
Sent: Thursday, April 26, 2007 7:38 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights
Bev,
You are completely right. This product that I have been "baptized" into
has been a 4 year terror. I am probably the 8th set of eyes to look at
it. I have seemed to make the most progress but that doesn't mean a
thing. All I do know is that the design is not good, the parts are
obsolete and the board is already being produced in a new generation
build, so basically I am stuck with what I have. Even though scrap is
high on this board, they just want to pump them out till they fizzle
out. So I am stuck with trying to find a reliable way to solder these
BGA's when in 4 years they haven't been able to on this board. I know
that the warping on the board is causing the issue in conjunction with
the uneveness of the BGA package, neither of which can be changed.
Ronald D. Peeler Jr., B.S. IE
Process Engineer
SWEMCO
Moorestown, NJ 08057
Tel: (856).222.9900 ext. 31
Cel: (484).948.0779
Fax: (856).222.0700
[log in to unmask]
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Wednesday, April 25, 2007 4:58 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights
Ron,
The problem right now is you see an effect and you do not know the
cause. It could be that the board and/or component warps and you have
opens. It could be that you have a head-in-pillow situation. It could
be that you have internal component opens. It could be that you have
cracked solder joints. You have to figure out which it is before you
try to apply a remedy.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ron Peeler
Sent: Wednesday, April 25, 2007 4:38 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights
Don't try me I just might ask you that...
:)
Ronald D. Peeler Jr., B.S. IE
Process Engineer
SWEMCO
Moorestown, NJ 08057
Tel: (856).222.9900 ext. 31
Cel: (484).948.0779
Fax: (856).222.0700
[log in to unmask]
-----Original Message-----
From: Wayne Thayer [mailto:[log in to unmask]]
Sent: Wednesday, April 25, 2007 4:35 PM
To: [log in to unmask]
Subject: Re: [TN] BGA Weights
Hi Ron!
I think most people solve this problem by making sure the board and BGA
are planar during the process, and that the solder paste is thick enough
to make up the difference. Then you have the "collapse" process working
for you too.
Weights can be used but are painful--last resort. They absorb heat,
messing up the solder profile, and need to be fixtured so they don't
fall off during reflow.
Next you are likely to ask for a rule of thumb for the pressure
supportable by the solder surface tension and the compression of the
solder balls which ensues. I don't know that--I just try weights until
it works.
Wayne Thayer
>>> [log in to unmask] 4/25/2007 4:23:12 pm >>>
Hello TechNet
I was wondering is there anything in the industry that is used to weigh
BGA's down? We are having an issue @ our shop with BGA's not soldering
effectively to one of our boards. Currently we have a board that is
suppose to go through a boot process, however it has problems doing so.
The issue is resolved when you press down in the middle of the BGA and
fails again once the BGA is released. It doesn't help that our board
warps easily as well. Is there anything, small gram weights or so that
can weigh down a BGA without shorting it?
Thanks
Ronald D. Peeler Jr., B.S. IE
Process Engineer
SWEMCO
Moorestown, NJ 08057
Tel: (856).222.9900 ext. 31
Cel: (484).948.0779
Fax: (856).222.0700
[log in to unmask]
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