George,
Good answer! In addition to surface characteristics, solderability is often
affected by other processing parameters. Therefore, a dip-and-look or a
wetting balance test might not be representative of the actual soldering
process. Interpreting of lab test results needs to take into account of
those affecting parameters.
Best regards,
Liang
Liang Yin
Process Research Engineer
Unovis Solutions
Binghamton, NY 13904
On Wed, 25 Apr 2007 06:22:55 -0400, Wenger, George M.
<[log in to unmask]> wrote:
>Is there a perfect solderability test? Well let me
>Liang Yin,
Is there a perfect solderability test? Well let me use Doug Paul's line
and say "that depends". Having worked with Lee at the AT&T facility at
Richmond and spent many years running the Bell Labs Engineering Research
Center FMA Lab I've found the best solderability test to be the actual
soldering process. I'm amazed how many times solder assembly engineers
would come or send components to the lab with components they say "don't
solder well" and would like me to test the solderability. My first
comment is that they already tested the solderability when they tried to
solder the component. If we were pressured into actually running a
solderability test in the lab and they wanted an answer immediately we
would run a Dip-&-Look solderability test like described by Greg Munie a
week ago in another TN response. If the person we were doing the
solderability test for had to have a quantifiable value we would run a
wetting balance solderability test. If the person we were doing the
solderability test for didn't believe the Dip-&-Look or wetting balance
results because they were like wave soldering (i.e., components dipped
into molten solder) and the components they were using were being
assembled by reflow surface mount soldering than we'd run the test that
Bev Christian recommends (i.e., simulated surface mount solderability
test).
The short answer is that the "Perfect Solderability Test" is the
actually soldering process.
Regards,
George
George M. Wenger
Andrew Corporation Wireless Network Solutions
Senior Principal FMA / Reliability Engineer
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [Office] (732) 309-8964 [Cell]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Liang Yin
Sent: Wednesday, April 25, 2007 12:04 AM
To: [log in to unmask]
Subject: Re: [TN] solderability testing
Lee,
Just follow up on your comment below, is there a perfect test for
solderability?
Thanks,
Liang Yin
Process Research Engineer
Unovis-Solutions
Binghamton, NY
On Mon, 23 Apr 2007 10:39:46 -0400, Lee parker <[log in to unmask]> wrote:
>Ioan
>
>At the AT&T facility in Richmond, we did both. The results were nearly
>always in close agreement. Since the dip and look test was far easier
to
>execute and could be performed by someone with less training, we
elected to
>use the dip and look procedure. Unfortunately, neither method is
perfect.
>
>Best regards
>
>Lee
>
>J. Lee Parker, Ph.D.
>JLP Consultants LLC
>804 779 3389
>
>
>
>
>
>----- Original Message -----
>From: "Tempea, Ioan" <[log in to unmask]>
>To: <[log in to unmask]>
>Sent: Monday, April 23, 2007 10:12 AM
>Subject: [TN] solderability testing
>
>
>Hi Technos,
>
>I need to setup a sort of solderability testing process.
>
>J-STD-002 is pretty clear, but I would like to know how are you set up
for
>the job. Mainly I would like to be able to make a decision on dip and
look
>OR wetting balance?
>What kind of equipment are you using?
>How to make the tests less of a black magic and more of a repeatable
>process, with easy to interpret results?
>
>Thanks,
>
>Ioan
>
>
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