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April 2007

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 2 Apr 2007 15:49:24 -0500
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The primary objective is to prevent outgassing of gases that could react
with other materials within the confined area. It is not limited to
space use, but because of the perfect vacuum of Space (0 torr) it
becomes more critical that it be limited or controlled. Outgassing does
happen at 1 atmosphere also (760 torr). It can be greatly elevated at
vacuum levels of as little as 2/3 atmosphere. When fully cured, the
materials themselves must not outgas significantly at 0 torr, which is
the natural perfect vacuum in space.
I cannot send any uncured epoxies into space, I have several tests I
must pass on a twice-monthly basis to prove the outgassing levels are
below a certain spec.
Likewise, the PWB must not outgas, therefore there is a specification
within 6012 to cover that.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Monday, April 02, 2007 3:23 PM
To: [log in to unmask]
Subject: Re: [TN] IPC 6012 : Outgassing Criteria

 

	Wee Mei:
	Out gassing is the decomposition of the material or the
evaporation of the material that can be a problem in an enclosed
environment such in submarines or outer space. The gasses can cool and
deposit in fiber optics or suffocate personnel. Even some pure metals
turn into gas at low pressures, outer space. Most materials provide gas
from their make up or outgas, some very little and a few none at all.
	Ramon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lum Wee Mei
Sent: Wednesday, March 28, 2007 11:17 PM
To: [log in to unmask]
Subject: [TN] IPC 6012 : Outgassing Criteria

Hello,
 
I was reading this IPC 6012 when I come across Section 3.11.1 Outgassing
 
1. What actually is outgassing?
2. Why is outgassing critical for PCB?
3. As the PCB consist of so many processes and different materials go
into making it, where did the outgassing come from? 4. Is the criteria
mandatory for all Class PCB or only specified application?
5. If for only specific application, which application and why?
6. Come to think about it, can the outgassing come also from the coating
we use to seal the assembly?
 
Hope someone out there can share with me (novice) on this issue.
 
Thanks and regards,
Wee Mei

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