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April 2007

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Mon, 23 Apr 2007 10:39:46 -0400
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Ioan

At the AT&T facility in Richmond, we did both. The results were nearly 
always in close agreement. Since the dip and look test was far easier to 
execute and could be performed by someone with less training, we elected to 
use the dip and look procedure. Unfortunately, neither method is perfect.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389





----- Original Message ----- 
From: "Tempea, Ioan" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, April 23, 2007 10:12 AM
Subject: [TN] solderability testing


Hi Technos,

I need to setup a sort of solderability testing process.

J-STD-002 is pretty clear, but I would like to know how are you set up for 
the job. Mainly I would like to be able to make a decision on dip and look 
OR wetting balance?
What kind of equipment are you using?
How to make the tests less of a black magic and more of a repeatable 
process, with easy to interpret results?

Thanks,

Ioan


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