Join IPC, in Singapore, for a series of workshops that address the
following important topics:
Compliant Electronics for EU Applications, May 28-29, 2007
Flexible Circuit Design Principles and Fabrication Requirements, June 7,
2007
Interconnect Technology Roadmapping Overview, June 7, 2008
Lead Free Component (Sn-Whisker), PCB (Materials), and Assembly
(Solder-Joint Reliability) Issues and Solutions, June 8, 2007
Compliant Electronics for EU Applications
May 28 & 29, 2007
Singapore, SG
Instructor: Dieter Bergman, IPC
Are you complying with the regulations developed by the European Union?
It is becoming one of the biggest challenges facing designers,
fabricators, and assemblers in the electronics interconnection industry.
This two-day workshop explores the actions necessary to be an active
player in tomorrow's electronics industry. Here's your opportunity to
get up-to-date!
Flexible Circuit Design Principles and Fabrication Requirements
June 7, 2007 - 8:30 am - 11:30 am
Singapore, SG
Instructor: Vern Solberg, MicroElectronic Engineering Services
The workshop will review flexible substrate material specifications and
standards developed to guide flex manufacturers and users. Material will
be presented that includes flex-circuit metallization technologies and a
number of fabrication methodologies comparing subtractive to
semi-additive plating technologies and panel processes to tape and reel.
Design guidelines for SMT will offer variations for land pattern
development, two metal layer via hole planning and methods used for
maximizing circuit routing densities and techniques for circuit
reinforcement.
This interactive half-day workshop has been developed specifically for
design professionals, IC packaging specialists, quality managers and
inspectors, systems engineers as well as assembly and test engineering
specialists for the OEM, ODM and EMS providers.
Interconnect Technology Roadmapping Overview
June 7, 2007 - 1:00 pm - 4:00 pm
Singapore, SG
Instructor: John T. Fisher, Interconnect Technology Analysis, Inc.
This session will provide an excellent base of knowledge for attendees
on Technology Roadmapping.
It will cover the elements of major technology roadmaps referenced in
the interconnect industry, the IPC's International Technology Roadmap
for Electronic Interconnections, iNEMI's International Technology
Roadmap, the SIA's International Technology Roadmap for Semiconductors
and the Japanese JISSO roadmap.
The workshop will review and compare the basis or purpose of the
roadmaps, which are all different. The types of different resources used
by the individual roadmap teams and the impact of those resources on the
roadmap outcome.
Attendees will also learn the differences in industry roadmaps and
corporate roadmaps and how corporate roadmaps may fit into the company
business planning activity.
The workshop is not intended to be a technology attribute comparison or
analysis, but rather a business - technology analysis of the roadmaps.
Lead Free Component (Sn-Whisker), PCB (Materials), and Assembly
(Solder-Joint Reliability) Issues and Solutions
June 8, 2007 - 8:30 am - 4:30 pm
Instructor: John Lau, Micro, Institute of Microelectronics
In this full-day course, some critical issues and their solutions of
lead free soldering (such as the latest EU and China regulations, cost,
design, materials, forward- and backward-process incompatibility,
inspections, tests, and reliability of components, PCBs, tin whiskers,
and solder joints) will be presented. Emphasis is placed on the lead
free critical issues and solutions of the most popular SMT packages such
as PQFP, PBGA, CSP, and flip-chip WLCSP.
To register for any of the above-mentioned workshops, please cut and
paste www.ipc.org/SingaporeWS07 into your browser to download the
registration form. Keep up with the latest industry topics!
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