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| Date: | Fri, 20 Apr 2007 18:14:43 -0500 |
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Hi Joe - this is an older article and there has been significant work on
the issue of Pbfree soldering and the formation of voids at the copper
pad/solder joint interface. The UIC consortia has active tasks and Carol
Handwerker has active tasks on the topic. The JCAA/JGPP consortia did not
see the "voiding" issue during its testing so the debate rages on as to
whether the phenomena is a diffusion issue, a copper quality issue, a
plating issue, a soldering issue, or a non-issue. I expect more data will
be presented on the topic during the year.
Dave Hillman
Rockwell Collins
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Joe Fjelstad
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OM> To
Sent by: TechNet [log in to unmask]
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Subject
04/19/2007 01:19 [TN] Fragility of Pb-free Solder
PM Joints
Please respond to
TechNet E-Mail
Forum
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; Please respond
to
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M
This just came in my email from SMT Net. I have not been able to link to
the
article yet but the title and first paragraph sounds familiar.
Joe
_Fragility of Pb-free Solder Joints_
(http://www.smtnet.com/adsystem/redir.cfm?adid=831)
_Universal Instruments_
(
http://www.smtnet.com/company/index.cfm?fuseaction=view_company&company_id=46383
)
Credit/Source: Peter Borgesen, Surface Mount Laboratory, Universal
Instruments; and Donald W. Henderson, IBM Corporation
Recent investigations have revealed that Pb-free solder joints may be
fragile, prone to premature interfacial failure particularly under shock
loading,
as initially formed or tend to become so under moderate thermal aging.
Depending on the solder pad surface finish, different mechanisms are
clearly
involved, but none of the commonly used surface finishes appear to be
consistently
immune to embrittlement processes. This is of obvious concern for products
facing relatively high operating temperatures for protracted times and/or
mechanical shock or strong vibrations in service...
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