Just notice this article in reading Fortune magazine:
http://money.cnn.com/magazines/fortune/fortune_archive/2007/02/05/8399195/index.htm

Shoveling IT - it's about electronics waste, and a dump in China:

"A health survey done last year by nearby Shantou University found that of
165 children under the age of 6 examined in Guiyu, 82% had symptoms of lead
poisoning."

Against current wisdom?

"A vast majority of the e-waste comes from the U.S. and countries in Europe
- despite rules established at the 1989 Basel Convention that banned the
trading of toxic materials. ... (The U.S. remains the only industrialized
nation that hasn't adopted the Basel guidelines.)"

Dave
-- 
++++++++++++++++++++
David Hudson

On 18/04/07, Stadem, Richard D. <[log in to unmask]> wrote:
>
> Joe the percipient sage, again. Damn straight answer.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
> Sent: Wednesday, April 18, 2007 2:21 PM
> To: [log in to unmask]
> Subject: Re: [TN] NTC An alternate view on lead in solders
>
> Hi John,
>
> Based on the tone of the comments, I don't think it would help.
>
> Best,
> Joe
> -----Original Message-----
> From: [log in to unmask]
> To: [log in to unmask]
> Sent: Wed, 18 Apr 2007 11:40 AM
> Subject: [TN] NTC An alternate view on lead in solders
>
>
> Hi Guys,
>
> Here is an alternate viewpoint on lead in solders sent to me though the
> site. Anyone want to educate Bill on the environmental aspects of this
> be my guest I have copied him on this email.
>
> Bill  - nice Loctite ad - do you work for them??
>
> John
>
>
>
> John Burke
>
>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Wednesday, April 18, 2007 8:41 AM
> To: [log in to unmask]
> Subject: EasySiteWizard FORM (http://www.rohsusa.com/home.html)
>
>
> FullName = Bill Fretts
>
> EmailFrom = [log in to unmask]
>
> Subject = Call the Waaambulance!
>
> MyComment = Buck up you whiners and start solving problems.
>
> > Lead has to get out of ewaste. Much of the world is burning it for
> energy
> reclamation / landfill diversion and the effects of the airborne lead
> needs
> to be a factor in the analysis. Local North American dumps are planning
> to
> burn now too. Balance the odd h/w failure with the survival of the
> species.
>
> > Tin whiskers - are manageable but you need standards on lead finishes.
> Consumer JEDEC parts don't care about whiskers since their stuff is
> disposable or 5 year life. NT and others have very specific finish
> specifications for their components to disqualify whisker prone finishes
> -
> bright tin & Bi in particular. Those tin whisker horror stories get
> trotted
> out every few years.
>
> > Hi Rel or Extreme Service SAC Reliability is pretty good. The joints
> are
> more brittle, but they're stronger too. If its for high mechanical shock
> service (automotive etc) look to the Locktite SAC solder flux /
> underfill,
> like peanutbutter for chocolate.
>
>
> Loctite(r) 3536 delivers improved reliability for today's advanced CSP
> and BGA
> packages. The material is designed to quickly fill the space beneath the
> CSP
> and BGA packages and cures rapidly at low temperature, which minimizes
> thermal stress to other components on the PCB and allows for in-line
> curing
> to increase device throughput. When fully cured, Loctite 3536 delivers
> excellent protection for solder joints against mechanical stress such as
> shock, drop and vibration in hand-held devices and testing confirms its
> superiority over competitive materials when subjected to these stresses.
> In
> addition, testing of the material to JEDEC drop test standards on 0.4mm
> and
> 0.5mm Pb-free devices has shown that Loctite 3536 offers five times the
> reliability over non-underfilled Pb-free devices.
>
> Xsubmit = Submit--
>

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