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April 2007

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Subject:
From:
Kerry McMullen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 19 Apr 2007 14:28:50 -0400
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Like a Swiss Watch????



Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
825 University Avenue
Norwood, MA 02062-2643
(T) 781-467-5468
(C) 508-631-1832
(F) 781-461-0993



Joe Fjelstad <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
04/19/2007 02:19 PM
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Subject
[TN] Fragility of Pb-free Solder Joints






 
This just came in my email from SMT Net.  I have not been able to link to 
the 
article yet but the title and first  paragraph sounds familiar. 
Joe 
_Fragility of Pb-free Solder Joints_ 
(http://www.smtnet.com/adsystem/redir.cfm?adid=831) 
_Universal Instruments_ 
(
http://www.smtnet.com/company/index.cfm?fuseaction=view_company&company_id=46383
) 
Credit/Source: Peter Borgesen, Surface Mount Laboratory, Universal 
Instruments; and Donald W. Henderson, IBM Corporation 
Recent investigations have revealed that Pb-free  solder joints may be 
fragile, prone to premature interfacial failure  particularly under shock 
loading, 
as initially formed or tend to become so under  moderate thermal aging. 
Depending on the solder pad surface finish, different  mechanisms are 
clearly 
involved, but none of the commonly used surface finishes  appear to be 
consistently 
immune to embrittlement processes. This is of obvious  concern for 
products 
facing relatively high operating temperatures for  protracted times and/or 

mechanical shock or strong vibrations in  service...



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