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April 2007

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Subject:
Re: Fragility of Pb-free Solder Joints
From:
Mike Buetow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mike Buetow <[log in to unmask]>
Date:
Thu, 19 Apr 2007 14:25:12 -0400
Content-Type:
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That's a 2004 paper they did. It's on the Universal website.
 
http://uic.com/wcms/WCMS2.nsf/index/Resources_75.html
 
Mike
 
Mike Buetow
Editor in Chief
Circuits Assembly
30 Glenburnie Road
Boston, MA 02131 USA
W/mobile: 617-327-4702
 
The 2007 Directory of EMS Providers: circuitsassembly.com/cms/dems


>>> [log in to unmask] 4/19/2007 2:19 PM >>>


This just came in my email from SMT Net.  I have not been able to link to the 
article yet but the title and first  paragraph sounds familiar. 
Joe  
_Fragility of Pb-free Solder Joints_ 
(http://www.smtnet.com/adsystem/redir.cfm?adid=831)  
_Universal Instruments_ 
(http://www.smtnet.com/company/index.cfm?fuseaction=view_company&company_id=46383)  
Credit/Source: Peter Borgesen, Surface Mount Laboratory, Universal  
Instruments; and Donald W. Henderson, IBM Corporation  
Recent investigations have revealed that Pb-free  solder joints may be 
fragile, prone to premature interfacial failure  particularly under shock loading, 
as initially formed or tend to become so under  moderate thermal aging. 
Depending on the solder pad surface finish, different  mechanisms are clearly 
involved, but none of the commonly used surface finishes  appear to be consistently 
immune to embrittlement processes. This is of obvious  concern for products 
facing relatively high operating temperatures for  protracted times and/or 
mechanical shock or strong vibrations in  service...



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