Hi Guys,

Here is an alternate viewpoint on lead in solders sent to me though the
site. Anyone want to educate Bill on the environmental aspects of this be my
guest I have copied him on this email.

Bill  - nice Loctite ad - do you work for them??

John

 
 
John Burke
 

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Wednesday, April 18, 2007 8:41 AM
To: [log in to unmask]
Subject: EasySiteWizard FORM (http://www.rohsusa.com/home.html)


FullName = Bill Fretts

EmailFrom = [log in to unmask]

Subject = Call the Waaambulance!

MyComment = Buck up you whiners and start solving problems.

 > Lead has to get out of ewaste. Much of the world is burning it for energy
reclamation / landfill diversion and the effects of the airborne lead needs
to be a factor in the analysis. Local North American dumps are planning to
burn now too. Balance the odd h/w failure with the survival of the species.

> Tin whiskers - are manageable but you need standards on lead finishes.
Consumer JEDEC parts don't care about whiskers since their stuff is
disposable or 5 year life. NT and others have very specific finish
specifications for their components to disqualify whisker prone finishes -
bright tin & Bi in particular. Those tin whisker horror stories get trotted
out every few years.

> Hi Rel or Extreme Service SAC Reliability is pretty good. The joints are
more brittle, but they're stronger too. If its for high mechanical shock
service (automotive etc) look to the Locktite SAC solder flux / underfill,
like peanutbutter for chocolate.


Loctite® 3536 delivers improved reliability for today’s advanced CSP and BGA
packages. The material is designed to quickly fill the space beneath the CSP
and BGA packages and cures rapidly at low temperature, which minimizes
thermal stress to other components on the PCB and allows for in-line curing
to increase device throughput. When fully cured, Loctite 3536 delivers
excellent protection for solder joints against mechanical stress such as
shock, drop and vibration in hand-held devices and testing confirms its
superiority over competitive materials when subjected to these stresses. In
addition, testing of the material to JEDEC drop test standards on 0.4mm and
0.5mm Pb-free devices has shown that Loctite 3536 offers five times the
reliability over non-underfilled Pb-free devices.

Xsubmit = Submit

 = 

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