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April 2007

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 2 Apr 2007 12:13:29 -0500
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text/plain
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text/plain (96 lines)
There is no doubt that manufacturing engineers everywhere hate both
sides of these parts equally. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paymon Sani
Sent: Monday, April 02, 2007 11:07 AM
To: [log in to unmask]
Subject: Re: [TN] Tombstoning MELF

Hello Paul,

We reference IPC-7351-A. The following are some suggestions for your
consideration:
1- Use optimized component land design
2- Design the board with suspect components in the same direction and
reflow them such that both sides of the component lead are hated at the
same time
3- Monitor the solder paste volume, they should be within the process
capabilities for both termination

Paymon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Black, Paul
Sent: April 2, 2007 11:13 AM
To: [log in to unmask]
Subject: Re: [TN] Tombstoning MELF

Good Morning Everyone,

I have a tombstoning problem with a MELF resistor. This board is built
in-house and also by a CM, and the problem exists in both processes. I
suspect the problem is the design of the pads. They are twice the length
and width of the MELF area that contacts the pad. This is the
recommended design of the manufacturer of the part. Can anyone point me
to any IPC spec or share their knowledge to get me going in the right
direction?

Thank you,
Paul Black
Manufacturing Engineer
Kronos Incorporated

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